| 分段加热对废旧线路板熔焊影响的数值模拟 |
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| 引用本文：张秋霞,张承龙,王景伟,符永高.分段加热对废旧线路板熔焊影响的数值模拟[J].上海第二工业大学(英文版),2021,(3):197-203 |
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| Author Name | Affiliation | | ZHANG Qiu-xia | 1a. School of Resources and Environmental Engineering
1b. Shanghai Collaborative Innovation
Centre for WEEE Recycling, Shanghai Polytechnic University, Shanghai 201209, China
| | ZHAGN Cheng-long | 1a. School of Resources and Environmental Engineering
1b. Shanghai Collaborative Innovation
Centre for WEEE Recycling, Shanghai Polytechnic University, Shanghai 201209, China
| | WANG Jing-wei | 1a. School of Resources and Environmental Engineering
1b. Shanghai Collaborative Innovation
Centre for WEEE Recycling, Shanghai Polytechnic University, Shanghai 201209, China
| | FU Yong-gao | 2. China National Electric
Apparatus Research Institute Co., Ltd., Guangzhou 5106631, China |
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| 基金项目:国家重点研发计划资助项目 (2018YFC1902300) 资助 |
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| 中文摘要:近年来电子产业发展正存在着消耗量大、消耗快速、浪费严重等不利情况。在电子废弃物中, 废旧手机芯片
仍具有一定的剩余寿命, 拥有较高的再利用价值。因此在废旧手机的拆解过程中提高拆解效率以及降低对芯片的损
害是十分有必要的。针对废旧手机线路板上电子元器件拆解过程中常见的熔焊问题, 以空气为加热介质, BGA 返修
台为加热工具, 并采用 FLUENT 软件进行模拟研究。分析对比了不同预热温度、保温时间和高温加热条件下焊点
熔化对于芯片拆卸效果的影响。研究结果表明, 当预热温度为 433 K, 保温时间为 40 s, 高温加热温度为 513 K 时, 拆
卸效果最好。 |
| 中文关键词:废旧线路板 分段加热 熔焊 数值模拟 |
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| Desoldering of Waste PCBs Heated by Segmented Heating Based on Numerical Simulation |
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| Abstract:In recent years, there are some disadvantages in the development of electronic industry, such as large consumption, rapid
consumption, serious waste and so on. Among the electronic wastes, waste mobile phone chips still have a certain residual life and
have high reuse value. Therefore, it is very necessary to improve the disassembly efficiency and reduce the damage to the chip in the
disassembly process of waste mobile phones. Aiming at the common welding problems in the disassembly of electronic components on
the circuit board of waste mobile phones, taking air as the heating medium, BGA repair bench as the heating tool, FLUENT software
is used for simulation research. The effects of solder joint melting on chip disassembly under different preheating temperature, holding
time and high temperature heating conditions are analyzed and compared. The results show that the disassembly effect is the best when
the preheating temperature is 433 K, the holding time is 40 s and the high temperature heating temperature is 513 K. |
| keywords:waste printed circuit boards sectional heating desoldering numerical simulation |
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