SiO₂@GNP/LDPE 复合材料的制备及其介电、导热性能

引用本文：杨晨,杨丹丹.SiO₂@GNP/LDPE 复合材料的制备及其介电、导热性能[J].上海第二工业大学(英文版),2021,(3):184-188

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Author Name	Affiliation
YANG Chen	School of Energy and Materials, Shanghai Polytechnic University, Shanghai 201209, China
YANG Dan-dan	School of Energy and Materials, Shanghai Polytechnic University, Shanghai 201209, China

基金项目:上海第二工业大学大学生创新项目 (202112044102) 资助

中文摘要:5G 通信的快速发展对低介电常数高导热系数的介质材料提出了明确要求。通过溶胶-凝胶法, 将球状二氧化硅 (SiO₂) 紧密包覆在片状石墨烯 (GNP) 上, 得到 SiO₂@GNP (SG) 复合材料, 再将其填充至低密度聚乙烯基体 (LDPE)中, 制得 SG/LDPE (SGL) 复合材料。研究表明, 相比于纯 LDPE, 当填料含量为 1% 时, SGL 复合材料的介电常数相比纯 LDPE 降低了 13.3% (10 Hz), 介电损耗低于 0.021 (10～10⁶ Hz), 导热系数达到了 0.555 W/(m · K), 较纯 LDPE 相比提升了 15%, 显示出良好的电绝缘性和导热性。这类具有低介电常数、低介电损耗和高导热系数的复合材料, 能够扩大应用场景, 提高使用寿命, 为 5G 通信领域的广泛应用提供一个可行的方向。

中文关键词:低介电常数高导热系数二氧化硅石墨烯低密度聚乙烯

Preparation and Dielectric and Thermal Conductivity of SiO₂@GNP/LDPE Composites

Abstract:With the rapid development of 5G communication, there are definite requirements for dielectric materials with low dielectric constant and high thermal conductivity. The spherical silica was tightly coated on flake graphene (GNP) and prepared SiO₂@GNP (SG) composites by sol-gel method, and then filled into the low density polyethylene (LDPE) matrix to prepare SG/LDPE (SGL) composites. Compared with pure LDPE, the dielectric constant of SGL composite with 1% filled content decreased by 13.3%, the dielectric loss is always lower than 0.021 (10～10⁶ Hz), and the thermal conductivity reaches 0.555 w/(m·K), which is increased by 15% of pure LDPE, showing good electrical insulation and thermal conductivity. This kind of composites with low dielectric constant, low dielectric loss and high thermal conductivity can expand the application scenario and improve the service life, providing a feasible direction for the wide application in the field of 5G communication.

keywords:low dielectric constant high thermal conductivity silicon dioxide graphene low density polyethyleneon

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